Aptek 6505PMF Electronic-grade, non-conductive adhesive

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Aptek 6505PMF Electronic-grade, non-conductive adhesive
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy overmolded devices. APTEK 6505-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates. Long RT pot life/snap heat cure-ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component stacking applications; Capable of cure at 80ºC to minimize harmful heat-sensitive components; Changes colors when gelation occurs-takes the guess work out of knowing when the material is gelled; Lower Tg version available in various size syringes and alternative containers to meet application requirements Information provided by Aptek Laboratories, Inc.
Vendors:

Available Properties
Density, ASTM D1475 Viscosity, (#7spindle/10 rpm) Hardness, Shore D, Cured property; ASTM D2240 Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property; ASTM D1002 Volume Resistivity, Cured property; ASTM D257 Flash Point, ASTM D92 Processing Temperature, Cure 1.5 hrs Processing Temperature, Cure 0.75 hrs

Property Data

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Category Notes
Plastic

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