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Metal adhesives
Aptek 6505PMF Electronic-grade, non-conductive adhesive
Categories: Polymer; Adhesive; Thermoset

Material Notes: APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy overmolded devices. APTEK 6505-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.

Long RT pot life/snap heat cure-ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component stacking applications; Capable of cure at 80ÂșC to minimize harmful heat-sensitive components; Changes colors when gelation occurs-takes the guess work out of knowing when the material is gelled; Lower Tg version available in various size syringes and alternative containers to meet application requirements

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density, ASTM D1475
  • Viscosity, (#7spindle/10 rpm)
  • Hardness, Shore D, Cured property; ASTM D2240
  • Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property; ASTM D1002
  • Volume Resistivity, Cured property; ASTM D257
  • Flash Point, ASTM D92
  • Processing Temperature, Cure 1.5 hrs
  • Processing Temperature, Cure 0.75 hrs
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Metal adhesives
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