Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste

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Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	This material is a lead-free, self-fluxing, no clean, environmentally acceptable solder substitute. It is specifically designed for electronic component assembly, especially surface mount. This product can be applied by either pneumatic dispensing or screen print methods, it is then hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This material is a unique electronic polymer that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging. Features: Pb-Free Intrinsically Clean Fine Pitch Low Stress Stable Junctions Self Fluxing Information provided by Cookson Electronics
Vendors:

Available Properties
Filler Content Brookfield Viscosity, Brookfield #52 spindle, 1 rpm Tensile Strength at Break Elongation at Break Tensile Modulus Adhesive Bond Strength, Die shear, Si die on gold pad Adhesive Bond Strength, Die shear, gold cover on gold plated ceramic substrate Volume Resistivity CTE, linear, Alpha 1 Thermal Conductivity Glass Transition Temp, Tg Pot Life, On screen Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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