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Master Bond adhesives
Reynolds Free Form™ Air HT Low density, lightweight epoxy putty
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Overview: Free Form™ AIR HT is a low density, lightweight epoxy putty that offers high temperature resistance to 300°F/149°C when cured at room temperature and 400°F/204°C when heat post cured. This is a low-odor, low shrinkage formula that is easy to use. Free Form™ AIR HT is mixed by hand with a 2A:1B by volume or weight mix ratio. It offers a long working time and cures overnight at room temperature to a hard, rigid epoxy that is very strong with modeling board-like properties. It can be sanded, shaped, drilled, tapped and CNC machined/routered. Epoxy Laminating; Laminate Free Form™ AIR HT putty in between layers of EpoxAmite™ HT Laminating Epoxy and fiberglass cloth, carbon or other fiber for making lightweight composite parts. Eliminates the need to make multiple layers of laminating with liquid epoxy; saves time and labor. Epoxy Tooling Applications – use as a filleting material. Also good for jig and fixture construction. Used as a lightweight adhesive, Free Form™ AIR HT will bond to itself and a variety of surfaces including wood, stone and EpoxAcoat™ HT surface coat epoxy. Pot Life/Working Time; this material is mass sensitive. The more material you mix at one time, the less time you have to work with it. Working tip; If mixing a large quantity, flatten putty with a rolling pin to reduce mass concentration and extend pot life.

Information provided by Reynolds Advanced Materials

Vendors:
Available Properties
  • Specific Gravity, ASTM D-1475
  • Hardness, Shore D, ASTM D-2240
  • Maximum Service Temperature, Air, ASTM D-648, Heat Deflection Temperature
  • Cure Time, Demold Time
  • Pot Life, ASTM D-2471
  • Pot Life, ASTM D-2471
  • Pot Life, ASTM D-2471
  
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Category Notes
Plastic

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