Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant

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Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for UL Standard 94. It qualifies for a horizontal burn rating at 1.5 mm thickness and has a CTI rating of 0. The system cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are enhanced by its high elongation giving it the ability to absorb differences in CTE’s of substrates and potted components. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1282 Clear will reach full cure at room temperature within 24 – 48 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 100°C are typical for small castings (less than 50 grams). Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Vendors:

Available Properties

Specific Gravity, TM R050-16, Part B
Specific Gravity, TM R050-16, Mixed
Specific Gravity, TM R050-16, Part A
Water Absorption, TM R050-35
Viscosity, TM R050-12, Part B, RVT, #3, 20 rpm.
Viscosity, TM R050-12, Part A, RVT, #3, 20 rpm.
Viscosity, Mixed
Hardness, Shore D
Tensile Strength at Break, TM R050-36
Tensile Strength, Ultimate, TM R050-36
Tensile Strength, Yield, TM R050-36
Elongation at Break, TM R050-36
Tensile Modulus, TM R050-36
Compressive Yield Strength, TM R050-38
Compressive Strength, TM R050-38, Ultimate
Compressive Strength, TM R050-38, Break
Compressive Modulus, TM R050-38
Adhesive Bond Strength, Lap Shear-Aluminum
Volume Resistivity
Dielectric Constant
Dielectric Constant
Dielectric Strength
Dissipation Factor
Dissipation Factor
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Transition Temp, Tg
Transmission, Visible, clear; thickness not quantified
Pot Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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