Description: NGAC TC907-09 is a medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications. Advantages and Applications: NGAC TC907-09 provides strong and high impact bonds which improve heat transfer while maintaining electrical insulation. It bonds to a wide range of substrates including metals, glass and plastics. The NGAC TC907-09 has a low coefficient of thermal expansion and will provide excellent resistance to mismatched substrates and very low shrinkage. Additionally, the NGAC TC907-09 is highly resistant to chemicals. Information Provided by Nextgen Adhesives |