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Ensinger PEI
Atom Adhesives AA-BOND G298 Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

Appearance: Resin: Brown, Hardener: Dark Brown

Cure Type: Heat cure or Room temperature


  • Gold filled epoxy allows for antioxidation of contacts and terminals in high reliability devices.
  • It can be used in medical circuits using traditional hybrid packaging technologies.
  • High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight: 100:13.5/Resin:Hardener

Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics

Typical Application:

  • Adhesive for joining die and SMDs onto the hybrid circuits.
  • Repairing defective Au thick-film conductor traces and contact pads.
  • Resisting oxidation and electromigration in high-reliability microelectronics.
  • Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C.

Information provided by Atom Adhesives

Available Properties
  • Particle Size, uncured
  • Viscosity, 0.5 rpm, uncured
  • Shear Strength, Die, @ 23°C: = 5 Kg
  • Volume Resistivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, TGA, Degradation Temp, uncured
  • Cure Time
  • Cure Time
  • Cure Time
  • Cure Time
  • Pot Life, uncured
  • Shelf Life
Property Data

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