Hexcel® HiFlow® RTM200 Bi-component Epoxy System

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Hexcel® HiFlow® RTM200 Bi-component Epoxy System
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Description: HiFlow® RTM200 is an aerospace bi-component toughened resin system with liquid Part A & Part B specially developed for Liquid Composite Molding technologies, such as LRI and RTM. Various applications for HiFlow® RTM200 exist throughout the UAM and UAV markets such as infused blades and other structures. Delivered as a bi-component system, HiFlow® RTM200 provides several benefits over a mono-component resin: Air shipment is allowed, and storage at 23± 5°C for 12 months and larger packages are possible. HiFlow® RTM200 has a low viscosity, allowing for easy processing. HiFlow® RTM200 has a cure temperature of 130°C and a service temperature of 90° C based on wet Tg. HiFlow® RTM200 Part A:B mixing ratio by weight is 100 : 81. HiFlow® RTM200 resin can be used in combination with HexForce®, HiTape® and HiMax® reinforcements. HiFlow® RTM200 is fully compatible with Hexcel binders and veils. They provide easy preforming properties and reinforcement dimensional stability. Advantages High glass transition temperatures: dry1: Tg> 135°C; wet2: Tg> 120°C < 100mPa.s at process temperatures Toughened system Liquid Part A & Part B at room temperature Longer shelf life (12 months at RT), as bicomponent system Flexible cure cycles available Low exotherm system Information provided by Hexcel Corporation.
Vendors:

Available Properties

Density, Neat Resin Cure cycle
Density, Part A
Density, Part A
Density, Part A
Density, Part A
Density, Part A
Density, Part A
Density, Part B
Density, Part A
Density, Part A
Density, Part C
Density, Part A
Density, Part C
Density, Part A
Density, Part C
Density, Part A
Density, Part C
Density, Part A
Density, Part C
Density, Part A
Density, Part C
Density, Part C
Density, Part C
Density, Part C
Density, Part C
Density, Part C
Density, Part C
Density, Part C
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Density, Part B
Viscosity, After Mix
Viscosity, After Mix
Viscosity, After Mix
Tensile Strength, EN6035, Open Hole, RT/dry
Tensile Strength, ISO527-4 T3, RT/dry
Tensile Modulus, ISO527-4 T3, RT/dry
Compressive Strength, EN6038, after 30J impact
Compressive Strength, EN6036, Open Hole, RT/dry
Compressive Strength, EN2850B, RT/dry
Compressive Modulus, EN2850B, RT/dry
Bearing Yield Strength, EN6037, RT/dry
Fracture Toughness
Shear Strength, EN2563, Interlaminar, RT/dry
Shear Strength, EN6031, In-Plane, RT/dry
CTE, linear
CTE, linear
CTE, linear
Glass Transition Temp, Tg, midpoint
Glass Transition Temp, Tg, onset
Glass Transition Temp, Tg, peak
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 200 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 1000 mPa.s
Gel Time, Time to reach 1000 mPa.s
Shelf Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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