Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2. Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation. Ease of use: potting and casting, encapsulation, and adhesive. Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level. Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / scientific instruments. Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light. BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications. Adhesion to glass, quartz, metals, wood and most plastics is very good. May also be used for impregnating wooden or porous objects for artifact restoration. Capable of both heat cure and room temperature cure. Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity, Part B
Specific Gravity, Part A
Viscosity, 100 rpm
Ionic Impurities - Na (Sodium)
Ionic Impurities - K (Potassium)
Ionic Impurities - Cl (Chloride)
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
Dielectric Constant
Dissipation Factor
CTE, linear, Below Tg
CTE, linear, Above Tg
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Refractive Index, uncured
Transmission, Visible, Spectral
Transmission, Visible, Spectral
Cure Time
Cure Time
Pot Life
Shelf Life
USP Class VI

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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