Master Bond EP29LPSPAO Two Component, Thermally Conductive Epoxy Adhesive

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Master Bond EP29LPSPAO Two Component, Thermally Conductive Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced; Epoxy, Thermally Conductive
Material Notes:	Master Bond Polymer System EP29LPSPAO is a two component, thermally conductive, electrically insulative, high performance epoxy system. It is specially formulated for cryogenic applications and requires a relatively low temperature heat cure. EP29LPSPAO is serviceable at temperatures as low as 4K as an adhesive, sealant, coating and encapsulant, but more importantly, it is able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).
Vendors:

Available Properties

Viscosity, Mixed
Viscosity, Part B
Viscosity, Part A
Hardness, Shore D
Tensile Strength
Tensile Modulus
Shear Strength, Al/Al
Volume Resistivity
Dielectric Constant
CTE, linear
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Cure Time
Cure Time
Cure Time
Pot Life, 100 gram mass
Shelf Life, in original unopened containers
Shelf Life, in premixed an frozen format

Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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