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Master Bond adhesives
Lord Adhesives Circalok™ 6031 A/B Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Circalok™ 6031 A/B is a two-part epoxy potting compound with excellent electrical properties at elevated temperatures. Good arc-track resistance under high voltage loading and other dielectric properties are maintained at an operating temperature of 155°C (311°F). This compound is recommended for potting military and industrial grade transformers, especially units designed for high temperature service. It is particularly resistant to thermal and mechanical shock and to conditions of high moisture. Heat aging characteristics are good; but there is some loss of physical (i.e. load-bearing) properties at elevated temperatures. The low viscosity and vapor pressure of this system facilitate rapid de-aeration and good impregnation. Because exotherm is minimal, very large castings can be poured without outgassing and with minimal stresses during cure. Properties obtainable exceed the requirements of MIL-I-16923, Type D.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity
  • Water Absorption
  • Loss On Ignition
  • Viscosity, mixed
  • Viscosity, catalyzed
  • Linear Mold Shrinkage
  • Hardness, Shore D
  • Tensile Strength, Yield
  • Elongation at Yield
  • Izod Impact, Notched
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Heat Distortion Temperature
  • Minimum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Cure Time, followed by 4 hours @ 160ºC
  • Cure Time, followed by 12 hours @ 120ºC
  • Pot Life
  • Shelf Life
  
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Category Notes
Plastic

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