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Master Bond adhesives
Honeywell ACCUGLASS® T12B 512B Spin-on Glass
Categories: Ceramic; Glass

Material Notes: The Accuglass T-12B (κ =3.2) Spin-on Glass (SOG) Series is a family of methyl-siloxane polymers used for interconnect and overcoat passivation in the manufacture of integrated circuits. The AccuglassT-12B series is specially formulated to fill narrow (down to 0.1µm), high aspect ratio (up to 10) gaps without voids while planarizing multi-level metal devices that require a lower κ than SiO2. AccuglassT-12B contains 15wt% CH3 (methyl) groups bonded to Si atoms in the Si-O backbone. The specific formulation results in a stable dielectric constant, high crack resistance, excellent gap fill and planarization properties of the cured film. In addition, post-cure films exhibit low shrinkage and are silanol (SiOH) free. Thin films of AccuglassT-12B are applied using a commercial coater and cured in a vertical or horizontal furnace to thicknesses up to 9000Å (single coat) and 2.0µm (double coat).

Benefits

  • Industry proven performance and broad acceptance
  • T-12B fills gaps as small as 0.1µm
  • High thermal stability. Compatible with hot aluminum and tungsten plug processing. Permeability allows for hydrogen annealing of gate oxides
  • Thickness variation within a wafer of less than 1% over 8-inch wafers
  • Lower dielectric constant compared to silicates, phosphorus silicates and most siloxanes
  • Crack resistance up to 2.0µm
  • Silanol free films post-cure
  • Good adhesion to top and bottom dielectric layer
Applications:
  • ILD and Planarization
  • Overcoat Passivation
  • Gapfill
AccuglassT-12B is suitable for gap fill and planarization of ILD layers used in multilevel metal IC devices. Typically, partial etchback (PEB) is used for ILD processing. AccuglassT-12B can also be used to improve planarization of the final passivation layer.

Information provided by Honeywell

Vendors:
Available Properties
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  • Dielectric Constant
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