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Rulon Bearings
Henkel Loctite® 3563 Epoxy Snap Cure Underfill
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.

Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.

Loctite® 3563 Epoxy Snap Cure Underfill
Designed specifically for high volume production of flip chip packaging in consumer electronics applications.

Vendors:
Available Properties
  • Density
  • Viscosity, Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
  • Tensile Modulus
  • CTE, linear
  • Glass Transition Temp, Tg
  • Cure Time
  • Shelf Life
  
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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