- Excellent choice for electronics soldering applications.
- Residues do not require removal.
Description: Superior No-Clean Core Flux is formulated for loading into No-Clean cored solder wire. This product meets the requirements specified in ANSI-J-STD-006 and Bellcore specifications on soldering fluxes. Superior No-Clean Core Flux is halide-free and may be left on assemblies post-soldering. The fluxing activity of this No-Clean, halide-free core flux is greater than that of many RMA type fluxes.Applications: Superior No-Clean Core Flux was formulated for the manufacture of No-Clean core solder wire in Conventional Lead-Free and Tin/Lead alloys. Its unique melting range and solidification temperature is compatible with the temperature parameters generally found during solder extrusion. A flux load of 0.8 to 1.2 percent by weight is recommended for No-Clean solder wire, however certain other loads, less or more, can be used. The flux residue is non-conductive and non-corrosive after soldering. No cleaning is required in most applications. Information provided by Superior Flux |