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Master Bond adhesives
TBA ECP 104/4264 Conductive Polypropylene for Injection Molding
Categories: Polymer; Thermoplastic; Polypropylene (PP); Polypropylene, Molded

Material Notes: ECP 104/4264 Conductive Polypropylene Injection Molding Compound – Low Resistance is a proprietary TBA injection molding compound utilizing special carbon black and mineral filler to give a permanently highly conductive, anti static material. The compound is designed to comply with the electrical conductivity requirements for materials laid out in Defense Standard (59-98) and BS IEC 61340-5-1:2007.

Applications: Moldings made from ECP 104/4264 exhibit excellent dimensional stability. Typical applications include:

  • Production aids for the electronics industry (eg, storage boxes, bins and PCB racks
  • Audio/hi-fi accessories
  • Static dissipating equipment housing and components requiring shielding and very conductive properties

Information provided by TBA Protective Solutions

Vendors:
Available Properties
  • Specific Gravity
  • Melt Flow
  • Tensile Strength
  • Flexural Strength
  • Flexural Modulus
  • Izod Impact, Notched
  • Charpy Impact Unnotched
  • Charpy Impact, Notched
  • Surface Resistivity per Square, ASTM D-257
  • Deflection Temperature at 0.46 MPa (66 psi)
  • Deflection Temperature at 1.8 MPa (264 psi)
  • Shrinkage
  • Processing Temperature, Cylinder
  • Mold Temperature
  • Drying Temperature
  • Dry Time
  
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Category Notes
Plastic

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