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Ensinger PEI
Aptek 2205 A/B Low modulus urethane stacking compound
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2205-A/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.

Good wet strength holds components in place allowing for the movement of the circuit boards during processing; 100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Available at two levels of reactivity to meet various productivity needs; available in pre-weighted kits to minimize handling time; ideal for field repair operations

APTEK 2205-A is a filled polyol resin that is safe to handle when used properly.. APTEK 2205-B is an organic isocyanate which make cause severe eye and skin irritation with direct contact..

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density, A Component; ASTM D1475
  • Density, B Component; ASTM D1475
  • Viscosity, B Component; ASTM D1824
  • Hardness, Shore A, Cured property; ASTM D2240
  • Tensile Strength, Ultimate, Cured property; ASTM D412
  • Elongation at Break, Cured property; ASTM D412
  • Volume Resistivity, Cured property; ASTM D257
  • Dielectric Constant, ASTM D150, Cured property
  • Dissipation Factor, ASTM D150, Cured property
  • CTE, linear, JMTP P200, Cured property; alpha 1
  • CTE, linear, JMTP P200, Cured property; alpha 2
  • Glass Transition Temp, Tg, Cured property; JMTP P-200
  • Flash Point, B Component; ASTM D92
  • Flash Point, A Component; ASTM D92
  • Processing Temperature, Cure 4 hrs
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