TRA-BOND 789-3 one component, high strength toughened adhesive is designed for microelectronic applications, including substrate attach and package sealing, which require good moisture resistance. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver and copper. This adhesive retains its bond strength after exposure to moisture. TRA-BOND 789-3 is available in a variety of colors to fit the application. Information provided by Tra-Con Inc. |