Key Properties Very high strength bonding of dissimilar materials. High moisture and solvent resistance. Fast ambient cure with good pot life. Ease of use. Applications Outstanding adhesive for very high strength potting and assembly applications. Bonds most plastics, metals, glass and ceramics. Good for electronics applications. High moisture resistance. Full cure 60 minutes at ambient or 10 minutes at 170º F or higher temperatures for faster cure down to 15 sec. Information provided by Reltek LLC |