Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) RN-1200 / EA-028 Conapoxy® Resin / Conacure® Hardener An undiluted, low viscosity potting and encapsulating system with excellent impact and thermal shock resistance.
- Mix Ratio, Resin/Hardener (by weight): 100/28
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |