Premixed-frozen, snap-cure, thermally conductive, adhesive
DIS-A-PASTE 2311-PMF is a one component, premixed frozen, mineral-filled, and light gray electrically insulated polymer paste adhesive. It is designed to bond many dissimilar substrates and dissipate device-generated heat. DIS-A-PASTE 2311-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/tack strength-holds components with minimal Z axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Low Tg (<50ºC) for low temperature cycling and performance with minimal stress. Excellent substrate adhesion; superior to silicones: no primer required. Information provided by Aptek Laboratories, Inc. |
