| Kalix® 2555 is a bio-sourced, polyamide-based compound with 55% by weight glass reinforcement. This material is specifically formulated for high strength and stiffness applications where good impact resistance, outstanding dielectric properties, and excellent dimensional stability after molding are required. Its low viscosity and excellent flow properties make the material ideal for filling parts with thin-walled sections such as those encountered in the mobile electronics industry. - Black: Kalix® 2555 BK 999 Applications: Cell Phones; Electrical Parts; Electrical/Electronic Applications; Thin-walled Parts Features: Fast Molding Cycle; Good Dimensional Stability; Good Electrical Properties; Good Impact Resistance; Good Surface Finish; High Flow; High Stiffness; High Strength; Hot Water Moldability; Paintable; Platable Typical values shown tested on Dry as Molded samples.
Standard Packaging and Labeling:
- Kalix® resin is packaged in foil lined, multiwall paper bags containing 25 kg (55 pounds) of material. Individual packages will be plainly marked with the product number, the color, the lot number, and the net weight. Injection notes: Storage:
- Kalix® compounds are shipped in moisture-resistant packages at moisture levels according to specifications. Sealed, undamaged bags should be preferably stored in a dry room at a maximum temperature of 50°C (122°F) and should be protected from possible damage. If only a portion of a package is used, the remaining material should be transferred into a sealable container. It is recommended that Kalix® resins be dried prior to molding following the recommendations found in this datasheet and/or in the Kalix® processing guide.
Drying:
- Kalix® is supplied in sealed bags. It should be dried before molding because excessive moisture content will result in reduced mechanical properties and processing issues, such as excessive nozzle drooling, foaming and splay visible on the molded parts.
- Use of a desiccant dryer with -40°C dewpoint is strongly suggested to ensure Kalix® material has reached optimum moisture content before processing.
Injection Molding:
- Set injection pressure to give rapid injection. Adjust holding pressure to one-half injection pressure. Set hold time to maximize part weight. Transfer from injection to hold pressure at the screw position just before the part is completely filled.
- For light colors use lower melt temperature if possible. If operating in the 330°C melt temperature range, keep residence times below 5 minutes.
- Actual mold temperatures of 80°C or above are recommended to improve flow and part surface finish. The use of mold temperatures below 80°C is safe for mechanical properties but may result in higher necessary injection pressure and inferior surface finish. Information provided by Solvay Specialty Polymers. |
