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Rulon Bearings
Henkel Loctite® 3440 1 component Gold/polymer filler Anisotropic Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes:
Electrically Conductive Bonding and Encapsulants and Underfills
Loctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.

Loctite offers a complete line of electrically conductive adhesives to meet almost any need including: flexible, heat cure, room temperature cure, screen printable, high adhesion, and rapid cure.

COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.

Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.

Loctite® 3440 1 component Gold/polymer filler Anisotropic Epoxy Adhesive
For flex circuit interconnect, TAB interconnection, smart cards, COB, COG. Suitable for LCD assembly. A gold/polymer-filled epoxy for flex circuit interconnect, TAB interconnection, smart cards, COG, and COG. Suitable for LCD assembly. Cure Type: Heat Bonding Type: Epoxy

Available Properties
  • Density
  • CTE, linear
  • Glass Transition Temp, Tg
  • Cure Time, 60 sec. @ 180ºC under 200 psi load
  • Shelf Life, shelf life at 5ºC
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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