Electrically Conductive Bonding and Encapsulants and Underfills
Loctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.Loctite offers a complete line of electrically conductive adhesives to meet almost any need including: flexible, heat cure, room temperature cure, screen printable, high adhesion, and rapid cure. COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate. Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive
A fusible solder-filled epoxy for higher current applications such as power circuit applications, flex circuit interconnect, TAB interconnect, smart cards, and COB. Cure Type: Heat Bonding Type: Epoxy |
