Description: DA 409 is a modified epoxy film adhesive which cures at 250°F (121°C). The adhesive, recommended for metal-to-metal bonds, bonding of composite and honeycomb structures, exceeds the requirements of MMM-A-132, Type 1, Class 3, MIL-A-25463, Type 1, Class 1 and 2, and ASTM-E-865. DA 409 can be supplied on woven or non-woven synthetic carriers.Information provided by Adhesive Prepegs for Composite Manufacturers, LLC |