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Master Bond adhesives
Honeywell TGP8000HV Thermally Conductive Gap Pads
Categories: Other Engineering Material

Material Notes: Benefits And Features:
  • High thermal performance
  • High breakdown voltage
  • Excellent surface wetting for low contact resistance
  • High reliability
  • Electrically insulating
Overview: Honeywell TGP8000HV is a Thermally Conductive Gap Pad which offers a good combination of low thermal impedance, high breakdown voltage and ease of use across multitude of applications. The naturally tacky property avoids the use of additional adhesive which could inhibit thermal performance. TGP8000HV is available in formats as standard sheets and custom die cut parts in a range of thickness.

Typical Applications:

  • Power devices & modules
  • Consumer electronics
  • Telecommunications & network servers
  • Automotive electronics
  • Semiconductors logics & memory

Information provided by Honeywell

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Hardness, Shore OO, ASTM D2240
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Strength, ASTM D149
  • Thermal Conductivity, ASTM D5470
  • Flammability, UL94
  • Shelf Life
  
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