Key Features:- Lower viscosity
- Thermally conductive
- Exceptional dimensional stability
- Rapid elevated temperature cures
- Can be cast in thicknesses up to 1 inch
- Superior electrical isolation properties
Product Description: Master Bond EP3RRLV is a one component, lower viscosity epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 250°F. This unique formulation offers high mechanical strength properties, outstanding dimensional stability, superior thermal conductivity and is eminently processable. It doesn’t require any mixing, it offers exquisite flow properties and has an unlimited working life. EP3RRLV also has sterling electrical insulation properties. One particularly uncommon and highly desirable property is its ability to cure in thicker sections up to 1 inch deep. EP3RRLV features versatile curing schedules with a 20-30 minute cure at temperatures as low as 250°F and a 10-15 minute cure at 300°F. EP3RRLV has a broad service temperature range of -60°F to +350°F. It adheres well to metals, ceramics, glass and most plastics. It has good resistance to a wide variety of water, oils and fuels. The color of EP3RRLV is light yellow; other colors are available upon request. EP3RRLV is a highly effective underfill epoxy and is widely used for microelectronics assembly and packaging applications, especially where good mechanical properties, convenient handling and fast curing are required. EP3RRLV is available in syringes for manual or automatic dispensing.Product Advantages: - Single component; no mixing needed; unlimited working life at room temperature
- Rapid curing with versatile cure schedules
- Top flight dimensionally stable
- Highly effective thermal conductivity and electrical isolation properties
- Convenient handling; excellent flow properties
- Exemplary performance as an underfill epoxy
- Can be cast in thicknesses up to 1 inchInformation provided by Master Bond Inc.
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