| XYDAR G-430 Liquid Crystal Polymer (LCP) is a glass reinforced injection molding grade developed specifically for electronic applications utilizing surface mount technology at lead-free solder temperatures. The heat deflection temperature of this resin is 568°F (298°C) and the moldability is exceptional. XYDAR G-430 resin can fill very thin walls over long flow lengths with little or no flash, even at mold temperatures below 200°F (93°C). In addition, it has low warpage in molded products and exceptional weld line strength. Like other XYDAR Liquid Crystal Polymers, this material exhibits high strength and stiffness (even at elevated temperatures), low coefficient of thermal expansion, high deflection temperature, inherent flame resistance, and outstanding resistance to most chemicals, weathering, and radiation. This resin is particularly well suited for many applications that have difficult-to-fill geometries, and require resistance to warp, strong weld lines, and compatibility with IR reflow environments. Potential applications for this resin include electronic connectors, surface mount interconnection devices, sockets, and PCMCIA card frames. Information provided by Solvay Advanced Polymers. |
