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Chemically Resistant adhesives
Aptek 6550-A/B Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers.

Part A is black. Part B is white.

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Viscosity, A Component; Spindle #7; speed 10 rpm; ASTM D1824
  • Viscosity, B Component; Spindle #7; speed 10 rpm; ASTM D1824
  • Ionic Impurities - Na (Sodium), Hydrolyzable
  • Ionic Impurities - K (Potassium), Hydrolyzable
  • Ionic Impurities - Cl (Chloride), Hydrolyzable
  • Hardness, Shore D, Cured property; ASTM D2240
  • Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property; ASTM D1002
  • Volume Resistivity, Cured property; ASTM D257
  • CTE, linear, Perkin Elmer TMS-2, Cured property; alpha 1
  • CTE, linear, Perkin Elmer TMS-2, Cured property; alpha 2
  • Thermal Conductivity, COLORA
  • Glass Transition Temp, Tg, Cured property; Perkin Elmer TMS-2
  • Flash Point, A Component; ASTM D92
  • Flash Point, B Component; ASTM D92
Property Data

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Chemically Resistant adhesives
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