| LinqSil™S-100 is a high-performance, high operating temperature mold release designed to release epoxy, polyurethane and polyester resins from their molds. Used extensively in the semiconductor passive device industry, it is an effective and versatile mold release agent for epoxy mold compounds. Despite being silicone-based, it is completely compatible with epoxy molding compounds, as well as liquid hot-and cold-curing epoxy, polyurethane and polyester resins. For EPDM, Nitrile and thermoplastic molding, please refer to LinqSil S200, and for flexible or rigid integral foams, please refer to LinqSil S300. LinqSil S100 has been designed not to char or burn at high temperatures, making it extremely well suited for high temperature molding. It has been used successfully in applications running as hot as 200°C. Despite being extremely well suited to high temperature applications, no heat-treatment is required to activate the mold release, so it is equally well-suited to cold-curing or room-temperature curing chemistries. Applications: - Epoxy, Polyurethane and Polyester Resin Mold Release
- Mold release for active semiconductors (ICs, TQFPs, BGAs, etc.)
- Mold release for passive semiconductors (resistors, capacitors)
- Mold release for transformers, inductors, relays, and electromedical applications
- New mold break-in
- Hot and cold curing systems
Information provided by Caplinq |
