| Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedule to attain optimal properties, including NASA low outgassing, is overnight at room temperature followed by a few hours at 150-200°F. It has a convenient one to one mix ratio by weight or volume. Its most outstanding features include high thermal conductivity, excellent electrical insulation properties and temperature resistance up to 400°F. Supreme 11AOHTL O is a “toughened” system which enables it to withstand rigorous thermal cycling and makes it well suited for bonding dissimilar substrates. It has excellent adhesion to most metals, ceramics, and glass as well as many rubbers and plastics. Its chemical resistance profile includes water, oil and fuels. Both Parts A and B are colored off-white. Master Bond Supreme 11AOHTLO is widely used in electronic, electro-optic, aerospace and vacuum applications where high strength, excellent thermal transfer properties, and high temperature resistance are required. Product Advantages: - Convenient one to one mix ratio by weight or volume.
- Versatile cure schedules: ambient or, for optimal properties, ambient combined with heat.
- Excellent bond strength to a wide variety of substrates.
- Toughened system, can withstand rigorous thermal cycling.
- High thermal conductivity with exceptional electrical insulation properties.
- Thermally stable up to 400°F with good thermal cycling properties.
- Exceptionally good dimensional stability.
- Passes NASA low outgassing.
Information provided by MasterBond® |
