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Master Bond adhesives
Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset
Material Notes: Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.

Information provided by Sumitomo Bakelite North America, Inc.
Vendors:
Available Properties
  • Density, ASTM D792
  • Water Absorption, ASTM D570
  • Linear Mold Shrinkage, ASTM D955
  • Tensile Strength at Break, ASTM D638
  • Flexural Strength, ASTM D790, at rupture
  • Flexural Modulus, ASTM D790
  • Compressive Strength, ASTM D695
  • Izod Impact, Notched, ASTM D256
  • Dielectric Constant, ASTM D150, wet
  • Dielectric Strength, ASTM D149, step-by-step, wet
  • Dielectric Strength, ASTM D149, short time, wet
  • Dissipation Factor, ASTM D150, wet
  • Arc Resistance, ASTM D495
  • Deflection Temperature at 1.8 MPa (264 psi), ASTM D648A, Post Baked
  
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Manufacturer Notes:
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Category Notes
Plastic

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