| Description: 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling. The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - Low Toxicity
- Green
- Low Viscosity
- Low Durometer
- Moisture Resistant
- Convenient Mix Ratios
- Low Shrinkage & Exotherm
Benefits: - Reduce employee exposure to dangerous chemicals
- Reduce demand on non-renewable fossil fuels
- Quick self leveling around components
- Low stress on components & vibration resistant
- Can be used in wet environments
- Will not damage components during cure
Information provided by Epoxies, Etc |
