| Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free flowing. Usually one part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation. EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy is its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4EN-80 will resist waters, oils and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The fact that this one part system with curing temperatures not exceeding 85°C, along with the other desirable properties mentioned above, offers an attractive option for small encapsulation applications in microelectronics. Product Advantages: - Single component; no mixing needed
- Unlimited working life at room temperature
- Easy to manage curing schedule
- Highly useful potting epoxy
- Low thermal resistant adhesive
- Passes NASA low outgassing specifications
Key Features: - Thermally conductive, electrically insulating
- Ultra fine particle size
- Can cure up to 1/4 inch thick
- High modulus and compressive strength
Information provided by Master Bond. |
