NANOPOX® products are high-performance concentrates of nanosilica in epoxy resins and are especially de-signed for electrical and electronic applications. The silica phase consists of surface-modified SiO2 nanospheres with a defined size of 20 nm and a very narrow particle size distribution. NANOPOX® products are used to replace part of the epoxy resin in an existing formulation; typically in the range of 25–40%. Some applications, however, require higher concentrations of nanosilica,. They can be blended with all commercial epoxy resins and cured using any commercial hardener. The introduction of nanosilica into the epoxy formulation improves various properties:- increased strength, modulus and hardness
- improved toughness
- synergy with conventional fillers, e.g., quartz powders
- significantly reduced electrocorrosion
- no change in Tg
As the viscosities of NANOPOX® products and their blends are very low, they are highly suitable for all potting applications, especially when high loading levels are desired. With a size of 20 nm, the silica particles penetrate even tightly meshed copper wiring easily, in areas where conventional fillers cannot penetrate. Using NANOPOX® E 601, you can formulate UV-curable systems. Application: Some examples of applications- electrical encapsulation
- potting resins for example, for generators (combined with conventional fillers)
- protective resins
- chip underfill resins
Information provided by Evonik |
