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Rulon Bearings
Lord Adhesives Thermoset™ ME-430 Epoxy Board Level Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications.

Thermoset ME-430 encapsulant offers good adhesion to both laminate and ceramic substrates, and can be used in demanding high-end, consumer printed circuit board and semiconductor applications.

All information provided by Lord.

Available Properties
  • Specific Gravity
  • Brookfield Viscosity, Spindle 14 @ 1rpm
  • Hardness, Shore D
  • Modulus of Elasticity, DMA
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, TMA, Below Tg
  • Glass Transition Temp, Tg, TMA
  • Cure Time
  • Pot Life
  • Gel Time
  • Shelf Life
  • Potassium, K
  • Sodium, Na
Property Data

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Ensinger PEI
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