LORD Thermoset™ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications. Thermoset ME-430 encapsulant offers good adhesion to both laminate and ceramic substrates, and can be used in demanding high-end, consumer printed circuit board and semiconductor applications. All information provided by Lord. |