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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for non-military low chloride applications.

Advantages & Application Notes:

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part A
  • Specific Gravity, Part B
  • Particle Size
  • Viscosity, 100 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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Chemically Resistant adhesives
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