Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher Tg Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC Level 3 Applications: Plaskon MUF-LFG Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the c
Vendors:

Available Properties

Specific Gravity
Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
Viscosity, Shimadzu Viscosity, 1000 psi
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot
Flexural Strength
Flexural Strength
Flexural Modulus
Flexural Modulus
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Mold Temperature
Back Pressure
Cure Time, In mold
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 21°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below.

Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message