Description: These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance.
10-3782 Very low viscosity
10-3783 Medium viscosity
10-3784 Paste non-sag
These unique adhesives exhibit outstanding bond strengths to a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc. They are currently used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications and anywhere a tough indestructible bond is requiredInformation provided by Epoxies, Etc |
