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Master Bond adhesives
Microtherm Group Freemoldings Pyrogenic Silica Thermal Insulation, E-Glass Reinforced
Categories: Ceramic; Oxide; Silicon Oxide; Other Engineering Material

Material Notes: Microtherm® Molded Products are Microtherm® high temperature thermal insulation sections molded in precision tooling for repeat accuracy of form and size, normally in large batches. Formulation based on pyrogenic silica with a mineral oxide opacifier and E-glass filament reinforcement.
    Properties
  • Microporous insulation offering the lowest theoretically possible thermal conductivity at high temperatures
  • Capable of continuous operation at temperatures up to 1000 °C (1832 °F)
  • Optimized design for customer product assembly
  • Non combustible
  • Environmentally safe.
  • Free of harmful respirable fibers.
    Applications
  • Large batch manufacture of complex shapes.

Information provided by Microtherm.

Vendors:
Available Properties
  • Density
  • Compressive Strength, ASTM C165, Resistance at 10%, 350 kg/m³
  • Compressive Modulus, ASTM C165, @ 350 kg/m³
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 320 kg/m³
  • Maximum Service Temperature, Air, for long term exposure
  
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