Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System

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Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Mix ratio 2 to 1 by volume. UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy based polymer is designed to gel with exposure to UV light followed by complete cure by internal chemical cross-link, with or without UV exposure. UV-MX 2240’s ability to “dark-cure” via conventional amine cure cross-linking makes it ideal for those applications that require the on-line speed of a UV cure and the versatility of a conventional two-part epoxy cure. Applications: Recommended for laminating, bonding and sealing applications of glass products where excellent wetting and outstanding impact strength is required. Electronic-Opto: Back filling of connectors, LED potting, glass touch screens. Processing: UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers. Information provided by Resin Technology Group.
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Available Properties
Specific Gravity Viscosity, Mixed Hardness, Shore D Tensile Strength at Break, Cured Elongation at Break, Cured Compressive Strength, Cured Shear Strength, Cured, lap, Al/Al, at 25°C Dielectric Strength, Cured Dissipation Factor, Cured Maximum Service Temperature, Air Minimum Service Temperature, Air Cure Time Cure Time Cure Time Pot Life Gel Time, 400 watt UV

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Plastic

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