Rogers Arlon TC600 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate

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Rogers Arlon TC600 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Microwave material for improved thermal management - for microwave printed circuit boards Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures Very Low Loss Tangent provides higher Amplifier or Antenna Efficiency Mechanically Strong; replaces brittle laminates that cannot withstand processing, impact or High G forces Priced Affordably for Commercial Applications High Peel Strength for Reliable Narrow Lines Benefits: Heat Dissipation and Management Replace Ceramic in Some Applications Improved Processing and Reliability Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs Typical Applications: Power Amplifiers, Filters and Couplers Microwave Combiner and Power Divider Boards in Avionics Applications Small Footprint Antennas Digital Audio Broadcasting (DAB) Antennas (Satellite Radio) GPS & Hand-held RFID Reader Antennas Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
Outgassing - Total Mass Loss, NASA SP-R-0022A
Collected Volatile Condensable Material, NASA SP-R-0022A
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4, Cross
Flexural Strength, IPC TM-650 2.4.4, Machine
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
Dielectric Constant, Resonant Cavity, may vary by thickness
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor, Resonant Cavity, may vary by thickness
Dissipation Factor, IPC TM-650 2.5.5.5, may vary by thickness
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Thermal Conductivity, ASTM E1461, z-axis
Thermal Conductivity, ASTM E1461, x, y
Decomposition Temperature, IPC TM-650 2.4.24.6, Initial
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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