| Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK®E4110, suggested for applications requiring a screen printing process as well as jetting. Advantages & Application Notes: - A thixotropic paste which enables ultra-fine pitch applications at the wafer or PCB/substrate packaging level. It may be dispensed, printed or jetted.
- Semiconductor Flip Chip Suggested Applications:
- Flip Chip attaching of IC’s direct to substrate or in semiconductor advanced plastic packages.
- “Dots” of E4110-PFC may be realized at 75µm diameter and 125µm pitch.
- Compatible with screen printing processes, whether mesh or stencil foils. The former requires > 200 mesh wires while the latter should be laser etched SST foil.
- Capable of curing at temperatures as low as 45°C for solder replacement.
- Medical Suggested Applications:
- Electrically conductive bridge when bonding Au-plated piezo-ceramic arrays to PCBs, used in ultrasonic devices.
- Flip chip attachment of photo-detector arrays found in X-ray and CT detectors
- Opto-electronics Suggested Applications
- Electrically conductive adhesive found in sensor and fiber optic devices
- Electrical bridge of ITO contact pads to PCBs found in LCD/Displays and OLED’s
Flex Circuits suggested Applciations.- Solar / Photo-voltaic. Adhesive for electrically back-contacting, thin film, organic and dye sensitized solar cells.
- Flip Chip adhesive dots bridging RFID chips to antennae, or smart card IC packaging.
- Electrical bridge of Au/PZT arrays to Au/Kapton found on ink-jetting circuits
Information Provided by Epoxy Technology |
