| LORD CoolTherm™ EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required. Features: maintains low viscosity for complete and void-free encapsulation. provides high thermal conductivity for applications where superior heat transfer is required. provides excellent high voltage insulation. exhibits low exotherm heat rise during room temperature cure. can be used on parts and devices that experience operating temperatures from-65°C to +155°C. provides excellent flame retardancy; UL 94 V-0 certified. All information provided by Lord. |
