| Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical conductivity, excellent adhesion, low temperature cure, easy mix ratio, low viscosity, low coefficient of thermal expansion, very low thermal impedance, and good thermal shock resistance. Typical Applications: Connects dissimilar materials electrically and thermally; Excels as a sealant for microwave modules and components; Ideal for circuit board repair and grounding applications and Useful for EMI shielding Information provided by Chomerics |
