Product Highlights:- High glass transition temperature
- Resists thermal and mechanical shocks
- Very good flow properties
- Superior chemical resistance
- Exceptional electrical insulation properties
- Phenomenal toughness
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This epoxy system offers excellent adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1452 HT-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive service temperature range of -60°C to +220°C. This adhesive has outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part A has a tan-brown color and Part B has an amber color. TUF 1452 HT-2 is widely used in the electronics, aerospace and various OEM applications. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
