| Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. It can cure at ambient temperatures or more rapidly at elevated temperatures. However, to optimize its properties it is recommended to add heat when curing. A highly effective cure schedule is overnight at room temperature followed by a few hours at 150-200°F. EP30M4LV resists water, acids, bases, fuels and oils, along with many strong solvents. Some of the potent chemicals it can resist include Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. This compound is 100% reactive and does not contain any solvents or other volatiles. EP30M4LV offers excellent adhesion to both similar and dissimilar substrates including metals, glass, ceramics and many plastics. It is also noteworthy for its superior electrical insulation properties. It has a low viscosity and excellent flow, along with lower exotherm, which can be used for a variety of moderately sized potting and encapsulation applications. EP30M4LV is serviceable over the wide temperature range of -80°F to +250°F. The color of Part A is clear and Part B is amber. Master Bond Polymer System EP30M4LV is widely used in the aerospace, OEM, electronic, electrical and electro-optic industries. Product Advantages: - Non-critical mix ratio: 100 to 60 by weight.
- Low viscosity, good flow; well suited for potting and encapsulation.
- Superior chemical resistance.
- Outstanding electrical insulation properties.
- High bond strength to a wide variety of substrates.
- Excellent physical strength properties.
Information provided by MasterBond® |
