Arlon Electronic Materials 35N Fast Cure Polyimide Laminate and Prepreg

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Arlon Electronic Materials 35N Fast Cure Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	High reliability and high temperature material 35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles. Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41 Toughened. Non-MDA chemistry resists drill cracking Compatible with lead-free processing RoHS/WEEE compliant Typical Applications: PCBs that are subjected to high temperatures during processing, such as lead-free soldering Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors. Information provided by ARLON Electronic Materials.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3, y
Tensile Strength, IPC TM-650 2.4.18.3, x
Modulus of Elasticity, IPC TM-650 2.4.18.3, y
Modulus of Elasticity, IPC TM-650 2.4.18.3, x
Poissons Ratio, ASTM D3039, y
Poissons Ratio, ASTM D3039, x
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.3, May vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Onset
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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