Appearance: Silver Filler Type: Silver Cure: Heat cure Product Benefits: - Excellent electrical conductivity
- Excellent thermal conductivity
- Hydrophobic
- Stable at high temperatures
- High resistance to delamination
- Void-free bondline
- Excellent adhesive strength
- High resistance to heat and humidity
- Good resistance to "popcorning" after exposure to reflow temperatures
Application: Die attach Surface Finishes: Copper, Silver-plated copper, Preplated leadframes (Ni/Pd/Au) and Alloy 42 Typical Applications: IC and component attach LOCTITE ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Information provided by Loctite® |