Henkel Loctite® ABLESTIK QMI3555R Conductive Adhesive

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Henkel Loctite® ABLESTIK QMI3555R Conductive Adhesive
Categories:	Polymer; Adhesive
Material Notes:	QMI 3555R is a low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C. QMI 3555R incorporates a patented silver/vanadium glass. Sub-350°C firing enhances the reliability of devices fabricated with sub-micron design rules. Also, in cofired package applications, nickel diffusion through gold plated seal rings and leadfinger pads are minimized at lower temperatures. QMI3555R low stress allows for a thin bondline, offering improved thermal performance for high power devices. Information provided by Loctite®
Vendors:

Available Properties
Filler Content Viscosity, Uncured, Speed 10 rpm Tensile Modulus, Cured, DMA Peel Strength, Tensile Adhesion, 0.6 x 0.6 inch Si die on ceramic Volume Resistivity, Cured CTE, linear, Cured, alpha1 Thermal Conductivity, Cured Glass Transition Temp, Tg, Cured Shelf Life, Uncured

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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