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Master Bond adhesives
HOS-Technik Homide 250 Bismaleimide Resin
Categories: Polymer; Thermoset; Bismaleimide (BMI)

Material Notes: Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excellent thermal and mechanical resistance. Homide 250 can be processed in powder form or dissolved in an organic solvent, such as dimethylformamide or N-methylpyrrolidone, up to a concentration of 45% for the production of composite materials.

Vendors:
Available Properties
  • Density, EN 60893
  • Water Absorption, EN 60893
  • Tensile Strength, EN 60893
  • Modulus of Elasticity, EN 60893
  • Flexural Strength, EN 60893, Perpendicular to laminations
  • Flexural Strength, EN 60893, Perpendicular to laminations
  • Flexural Strength, EN 60893, Perpendicular to laminations
  • Flexural Strength, EN 60893, Perpendicular to laminations
  • Flexural Strength, EN 60893, Perpendicular to laminations
  • Compressive Strength, EN 60893, Perpendicular to laminations
  • Compressive Strength, EN 60893, Perpendicular to laminations
  • Compressive Strength, EN 60893, Perpendicular to laminations
  • Compressive Strength, EN 60893, Perpendicular to laminations
  • Compressive Strength, EN 60893, Perpendicular to laminations
  • Shear Strength, EN 60893, Parallel to laminations
  • Izod Impact Resistance, EN 60893, Parallel to laminations
  • Insulation Resistance, EN 60893, After immersion in water
  • Dielectric Constant, EN 60893
  • Dielectric Strength, EN 60893, Tested in oil. Perpendicular to laminations.
  • Dissipation Factor, EN 60893
  • Flammability, UL94, EN 60893
  
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Manufacturer Notes:
HOS-Technik GmbH

Category Notes
Plastic

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