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Master Bond adhesives
ETEC (EnvisionTEC) ETECĀ® E-RigidForm, PU 77 cDLP 3D Printing Photopolymer
Categories: Polymer; 3D Printing/Additive Manufacturing Polymer; Thermoset

Material Notes: Property data for resin as-supplied

Photopolymer E-Rigid Form, PU 77 is a light curing resin for Envision Tec's family Computer Aided Modeling Devices. DLP 3D printing technology (Continuous Digital Light Processing) is a vat-polymerization additive manufacturing process that enables high-volume and scalable part production. Through combining the energy of light with long-chain material chemistry and industrial-grade materials, the cDLP 3D printing process is an effective way to produce complex end-use parts with the speed and economics comparable to traditional manufacturing methods like injection molding.

Vendors:
Available Properties
  • Density
  • Water Absorption
  • Viscosity, Dynamic, Liquid as Supplied
  • Hardness, Shore D
  • Tensile Strength
  • Elongation at Break
  • Tensile Modulus
  • Flexural Strength
  • Flexural Modulus
  • Izod Impact, Notched
  • Boiling Point
  • Deflection Temperature at 1.8 MPa (264 psi)
  • Flash Point, Liquid as Supplied
  
Property Data

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Category Notes
Plastic

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